Anna Andonova, "Comparison of transient thermography methods for defect detecting in electronic components and modules," International Journal of Applied Mathematics, Computational Science and Systems Engineering, vol. 3, pp. 94-98, 2021, DOI:
Anna Andonova. Comparison of transient thermography methods for defect detecting in electronic components and modules.
International Journal of Applied Mathematics, Computational Science and Systems Engineering. 2021;3:94-98.
International Journal of Applied Mathematics, Computational Science and Systems Engineering
E-ISSN: 2766-9823
Volume 3, 2021
Comparison of transient thermography methods for defect detecting in electronic components and modules
Author:
Abstract: The article examines different methods of transient thermography applied to analyze the faults and detection of hidden defects in electronic components and modules. A brief analysis of the methods and recommendations for their application is presented. A systematic approach to designing a transient thermographic measurement system for the detection and analysis of faults and hidden defects in electronic components and modules is developed. Some experimental results are shown.
Pages: 94-98 DOI: *As the DOI is a unique identifier, it is already available in the pdf version.
**The DOI link will be activated in the first midst of January 2026.
WSEAS Transactions on International Journal of Applied Mathematics, Computational Science and Systems Engineering, E-ISSN: 2766-9823, Volume 3, 2021, Art. #17
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